| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an insulating substrate or a metal-clad laminate capable of sufficiently reducing or preventing minus warpage of a semiconductor device, and to provide a printed wiring board and a semiconductor device using the insulating substrate or the metal-clad laminate. <P>SOLUTION: A printed wiring board is manufactured by using, as a core substrate, an insulating substrate or a metal-clad laminate including the insulating substrate which includes one or more fiber base material layer and two or more resin layers, where the outermost layer on both surfaces are composed of a hardened material of a hardened laminate that is a resin layer, at least one fiber base material layer is located eccentrically to one or the other surface side from a reference position, i.e., a position dividing the thickness of each region obtained by dividing the total thickness of the insulating substrate equally by the number of the fiber base material layers further equally by two, and no fiber base material layer is located eccentrically in a different direction. A semiconductor device is manufactured by mounting a semiconductor element on the printed wiring board. <P>COPYRIGHT: (C)2013,JPO&INPIT |
