发明名称 |
Etch method for removing metal-fluoropolymer residues |
摘要 |
A method for removing a metal-fluoropolymer residue from an integrated circuit structure within an integrated circuit. There is first provided an integrated circuit having formed therein a metal-fluoropolymer residue. The metal-fluoropolymer residue is formed from a first plasma etch method employing a fluorocarbon containing etchant gas composition within the presence of a conductor metal layer within the integrated circuit. The metal-fluoropolymer residue is then exposed to a second plasma etch method employing a chlorine containing etchant gas composition to form from the metal-fluoropolymer residue a chlorine containing plasma treated metal-fluoropolymer residue. Finally, the chlorine containing plasma treated metal-fluoropolymer residue is removed from the integrated circuit through a stripping method sequentially employing an aqueous acid solution followed by an organic solvent.
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申请公布号 |
US5865900(A) |
申请公布日期 |
1999.02.02 |
申请号 |
US19960725805 |
申请日期 |
1996.10.04 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
LEE, CHIARN-LUNG;SHU, HUAI-JEN;YEN, YING-TZU |
分类号 |
H01L21/02;H01L21/3213;(IPC1-7):H01L21/306;H01L21/306;C23G1/02 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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