| 摘要 |
A contact pad for an electronic device integrated in a semiconductor material chip is formed from a succession of protruding elements. Each protruding element extends transversally to a main surface of the chip and has a rounded terminal portion. Adjacent pairs protruding elements define an opening which is partially filled with a first conductive material to form a contact structure that is in electrical contact with an integrated electronic device formed in the chip. A layer of a second conductive material is deposited to cover said protruding elements and the contact structures so as to form the contact pad.
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