Soldering tip, having a surface with a grid structure

摘要

The invention relates to a soldering tip (1) for a soldering device, which comprises a heat generating or heat conducting base body (4), and which on the outside thereof has a contact surface (11) that can be wetted by solder (12) at least in sections, wherein the material of the contact surface (11) has a grid structure. The soldering tip (1) according to the invention further encompasses the incorporation of charged elementary particles of at least one foreign material into the grid structure of the contact surface (11).