发明名称 |
LOW-PROFILE HEAT-SPREADING LIQUID CHAMBER USING BOILING |
摘要 |
Systems and fabrication methods are disclosed for a heat spreader to cool a device. The heat spreader has first and second opposing proximal surfaces defining a chamber having a liquid therein; and one or more structures mounted in the chamber to induce a liquid flow pattern during a boiling of the liquid to distribute heat.
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申请公布号 |
US2013020053(A1) |
申请公布日期 |
2013.01.24 |
申请号 |
US201213489697 |
申请日期 |
2012.06.06 |
申请人 |
YOU SEUNG MUN;KIM JOO HAN;KWARK SANG M.;KIM JESSE JAEJIN |
发明人 |
YOU SEUNG MUN;KIM JOO HAN;KWARK SANG M.;KIM JESSE JAEJIN |
分类号 |
F28D15/02;F28F13/18 |
主分类号 |
F28D15/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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