METHOD OF MANUFACTURING A RIGID-FLEX PRINTED CIRCUIT BOARD OR A SUB-ASSEMBLY THEREOF AS WELL AS RIGID-FLEX PRINTED CIRCUIT BOARD OR A SUB-ASSEMBLY THEREOF

摘要

A method of manufacturing a rigid-flex printed circuit board or a sub-assembly thereof comprises the following steps : - providing a layer of rigid insulating material (1) removing at least one area of the rigid insulating material - inserting a flexible insulating material (3) into the removed or cut-out area(s) of the rigid insulating material (1); - covering the rigid and flexible insulating material (1, 3) with a layer (4) of conductive material on at least one surface; - building up at least one further layer (5, 6, 7, 8) of the rigid-flex printed circuit board (10) at least on the rigid part(s) of the insulating material, wherein the at least one further layer (5, 6, 7, 8) of the rigid-flex printed circuit board (10) is partly overlapping the flexible area(s) (3) of the insulating material. Furthermore a rigid-flex printed circuit board (10) or subassembly thereof is provided.