| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate processing method and a substrate processing apparatus which suppress pattern collapse when a substrate is dehydrated after a liquid treatment. <P>SOLUTION: There is provided a substrate processing method. The substrate processing method includes a process of treating a substrate that has a structure formed on at least a principal plane by liquid. The substrate processing method further includes a process of bring a solution into contact with the structure wetted with the liquid and forming a supporting material that supports the structure by changing at least a part of the solution into a solid state by at least any one of the steps of: reacting the solution; decreasing the amount of solvent contained in the solution; and depositing at least a part of materials solved in the solution. The substrate processing method further includes a process of removing the supporting material by changing the supporting material from a solid phase to a vapor phase without passing through a liquid phase. <P>COPYRIGHT: (C)2013,JPO&INPIT |
