发明名称 PIEZOELECTRIC DEVICE AND PIEZOELECTRIC MODULE
摘要 <P>PROBLEM TO BE SOLVED: To provide a piezoelectric device which achieves stress relaxation during mounting, maintains mechanical strength, and is suitable for downsizing of the piezoelectric device. <P>SOLUTION: A piezoelectric device includes: a piezoelectric vibration substrate 20 having a frame part 30 and a piezoelectric vibration piece 22 disposed on the inner peripheral side of the frame part 30; a first substrate 12 disposed so as to face one main surface of the piezoelectric vibration substrate 20 and joined to the frame part 30; a second substrate 40 disposed so as to face the other main surface of the piezoelectric vibration substrate 20 and joined to the frame part 30. Connection parts 32, 36 are disposed at end parts of an outer periphery of the frame part 30 which face each other across the piezoelectric vibration piece 22, and slits, respectively cut so as to divide one side of the connection parts 32, 36 into two pieces, are provided on the piezoelectric vibration substrate 20. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013017143(A) 申请公布日期 2013.01.24
申请号 JP20110150444 申请日期 2011.07.06
申请人 SEIKO EPSON CORP 发明人 ICHIKAWA SO
分类号 H03H9/19;G01L9/00;H01L29/84;H01L41/08;H01L41/09;H01L41/18;H01L41/187;H01L41/22;H03H9/02 主分类号 H03H9/19
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