| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve such a problem that the chip size increases when configuring a three-wavelength semiconductor laser device by arranging a two-wavelength laser consisting of a red laser diode and an infrared laser diode, and a blue-violet laser diode side by side, because the distance between the light-emitting points of two lasers in the two-wavelength laser is limited, and that the manufacturing cost increases when stacking the two-wavelength laser and the blue-violet laser vertically because the assembly process is complicated. <P>SOLUTION: A three-wavelength semiconductor laser device is configured by mounting a blue-violet laser diode and a two-wavelength laser diode, having the light-emitting points formed near the chip end, side by side. This can provide an easy-to-manufacture three-wavelength semiconductor laser device in which three light-emitting points can be brought close to each other. <P>COPYRIGHT: (C)2013,JPO&INPIT |
