| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition that can be cured at low temperature, can be developed with an aqueous alkali solution, has sufficiently high sensitivity and resolution and can form resist patterns with excellent adhesiveness and thermal shock resistance, as well as a method of producing a resist pattern using the positive photosensitive resin composition, a semiconductor device having a resist pattern formed by the method, and an electronic device comprising the semiconductor device. <P>SOLUTION: The positive photosensitive resin composition contains an alkali-soluble resin having a phenolic hydroxyl group, a compound which generates an acid due to light, a heat-crosslinking agent, and an acrylic resin including a C4-C20 alkyl (meth)acrylate unit, a (meth)acrylic acid unit and a (meth)acrylate unit having a primary, secondary or tertiary amino group in a side chain. <P>COPYRIGHT: (C)2013,JPO&INPIT |
