发明名称 MANUFACTURING METHOD OF NITRIDE SEMICONDUCTOR LIGHT-EMITTING ELEMENT, WAFER AND NITRIDE SEMICONDUCTOR LIGHT-EMITTING ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a nitride semiconductor light-emitting element which can improve reliability of electrical characteristics; a wafer which can improve reliability of electrical characteristics of a nitride semiconductor light-emitting element; and a nitride semiconductor light-emitting element which can improve reliability of electrical characteristics. <P>SOLUTION: In a manufacturing method of a nitride semiconductor light-emitting element including a single crystal substrate 1, an AlN layer 2, a first conductivity type first nitride semiconductor layer 3, a luminescent layer 4 composed of an AlGaN-based material and a second conductivity type second nitride semiconductor layer 6, the method of forming the AlN layer 2 comprises: a first process of supplying a material gas of Al and a material gas of N to form a group of Al-polarity AlN crystal nuclei 2a which become a part of the AlN layer 2, on one surface of the single crystal substrate 1; and a second process of supplying a material gas of Al and a material gas of N after the first process to form the AlN layer 2. In the first process, a substrate temperature is set at a first predetermined temperature which enables suppression of growth of N-polarity AlN crystals 2b. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013016711(A) 申请公布日期 2013.01.24
申请号 JP20110149506 申请日期 2011.07.05
申请人 PANASONIC CORP;INSTITUTE OF PHYSICAL & CHEMICAL RESEARCH 发明人 TAKANO TAKAYOSHI;MINO TAKUYA;NOGUCHI NORIMICHI;TSUBAKI KENJI;HIRAYAMA HIDEKI
分类号 H01L33/32 主分类号 H01L33/32
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