发明名称 |
ELECTROSTATIC CHUCK ASSEMBLY WITH DIELECTRIC MATERIAL AND/OR CAVITY HAVING VARYING THICKNESS, PROFILE AND/OR SHAPE, METHOD OF USING THE SAME AND APPARATUS INCORPORATING THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To improve the uniformity of an electric flux above a workpiece during a plasma processing process. <P>SOLUTION: An electrostatic chuck assembly 100 having a dielectric material 108 and/or having a cavity 106 with varying thickness, profile and/or shape includes a conductive support 102 and an electrostatic chuck ceramic layer 104. A dielectric layer or an insert 108 is located between the conductive support 102 and the electrostatic chuck ceramic layer 104. A cavity 106 is located in a seating surface of the electrostatic chuck ceramic layer 104. An embedded pole pattern can be optionally incorporated in the electrostatic chuck assembly. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013016818(A) |
申请公布日期 |
2013.01.24 |
申请号 |
JP20120175348 |
申请日期 |
2012.08.07 |
申请人 |
LAM RESEARCH CORPORATION |
发明人 |
DINJAR RAJINDER;LENTZ ERIC;LI LIU-MIN;KOZAKEVICH FELIX |
分类号 |
H01L21/683;B23Q3/15;H01L21/205;H01L21/3065;H01L21/31;H05H1/46 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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