发明名称 COOLING MECHANISM
摘要 <P>PROBLEM TO BE SOLVED: To provide a cooling mechanism capable of efficiently cooling with a heat removal fluid regardless of a fact that at least two heating bodies, being small and thin with different heating value, are mounted on the same module. <P>SOLUTION: The cooling mechanism includes post-like and plate-like heat sinks that are thermally connected to heating bodies 201 and 202, with the heat sinks arranged relatively on the upper stream side in the distribution direction and the lower stream side in that of a heat removal fluid respectively. It includes a first duct 10 which applies a speed vector that inclines against the height direction of the post-like heat sink to the heat removal fluid, for cooling in collision jet the post-like heat sink, and a second duct 20 which applies a speed vector parallel to the length direction of the plate-like heat sink to the heat removal fluid, for cooling in laminar flow or in turbulence the plate-like heat sink. These ducts are connected together so that the heat removal fluid discharged from the first duct is pulled in for confluence with the heat removal fluid, for cooling in laminar flow or in turbulence. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013016569(A) 申请公布日期 2013.01.24
申请号 JP20110146969 申请日期 2011.07.01
申请人 NIPPON TELEGR & TELEPH CORP <NTT> 发明人 TANOBE HIROMASA;ENDO JUN;YONEYAMA MIKIO
分类号 H05K7/20;H01L23/467 主分类号 H05K7/20
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