| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a configuration of a semiconductor device, which can reduce crosstalk noise in a signal bonding wire without causing increase in the total number of external terminals and without being associated with significant deterioration in signal transmission characteristics. <P>SOLUTION: A semiconductor device comprises a ground lead connected to a mounting island. Wire profiles of a signal bonding wire and a ground bonding wire are conformed. A height of a connection part of the signal bonding wire and a signal lead and a height of a connection part of the ground bonding wire and a ground lead are made level with each other. <P>COPYRIGHT: (C)2013,JPO&INPIT |
