发明名称 EPITAXIAL SUBSTRATE AND METHOD FOR MANUFACTURING EPITAXIAL SUBSTRATE
摘要 Provided is a crack-free epitaxial substrate. The epitaxial substrate includes: a (111) single crystal Si substrate and a buffer layer formed of a first and a second lamination unit being alternately laminated such that each of an uppermost and a lowermost portion of the buffer layer is formed of the first lamination unit. The first lamination unit is formed of a first and a second composition layer having different compositions being alternately laminated so as to increase the thickness of the second composition layer in a portion more distant from the base substrate side, to thereby cause a compressive strain to exist in the first lamination unit such that it increases in a portion more distant from the base substrate. The second lamination unit is formed as an intermediate layer that is substantially strain-free and formed with a thickness of 15 nm or more and 150 nm or less.
申请公布号 US2013020583(A1) 申请公布日期 2013.01.24
申请号 US201213627206 申请日期 2012.09.26
申请人 NGK INSULATORS, LTD.;NGK INSULATORS, LTD. 发明人 MIYOSHI MAKOTO;SUMIYA SHIGEAKI;ICHIMURA MIKIYA;MAEHARA SOTA;TANAKA MITSUHIRO
分类号 H01L29/205;H01L21/20;H01L29/20 主分类号 H01L29/205
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