| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a mold package in which one end side of a sensor chip is sealed with mold resin, for cantilevering with the mold resin, capable of preventing looseness of the sensor chip before sealing with the mold resin, for excellent handling property of a work during a process. <P>SOLUTION: In the method of manufacturing a mold package S1, one end 23 side of a sensor chip 20 is sealed with mold resin 50, for cantilevering with the mold resin 50. An object that contains a support part 33 for supporting the other end 24 side of the sensor chip 20 is prepared as a lead frame 30. The other end 23 side of the sensor chip 20 is received and supported by the support part 33. While supporting by the support part 33 is being kept, sealing is made with the mold resin 50, and then the support part 33 is cut out of the lead frame 30, and the support part 33 is removed from the other end 24 side of the sensor chip 20. <P>COPYRIGHT: (C)2013,JPO&INPIT |
