| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device, especially a semiconductor device on which an LED semiconductor element is to be mounted, which is excellent in thermal conductivity and connection reliability, and capable of thinning to a higher degree. <P>SOLUTION: A semiconductor element mounting member 10 has a conductive metal layer pattern 14 and an insulation part 15 on a carrier substrate 11. The metal layer pattern is covered by the insulation part at least on a peripheral edge so as to have an exposed part in a portion of the metal layer pattern. The metal layer pattern has a cross sectional shape such that an outermost peripheral part of the metal layer pattern protrudes from a part where the metal layer pattern and the carrier substrate are in contact with each other to the insulation part side when viewed from the side of the metal layer pattern of the member. A thickness of the metal layer pattern is within a range of 3-150 μm. <P>COPYRIGHT: (C)2013,JPO&INPIT |
