| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit board which eliminates the need of connection components between substrates and reduces the projection area of the substrates. <P>SOLUTION: A third copper plate 60 has: a first portion 61 to which a first insulative core substrate 40 is bonded; a second portion 62 to which a second insulation core substrate 50 is bonded; and a folding part 63 connecting the first portion 61 with the second portion 62 and folded so that a first copper plate 90 faces a second copper plate 91. The third copper plate 60 has a thickness which is larger than those of the first copper plate 90 and the second copper plate 91 and enables support of the first insulative core substrate 40 and the second insulative core substrate 50. Further, a cross section area of a current path of the third copper plate 60 is larger than a cross section area of a current path in the first copper plate 90 and a cross section area of a current path in the second copper plate 91. <P>COPYRIGHT: (C)2013,JPO&INPIT |
