发明名称 SUBSTRATE FOR WALLBOARD JOINT TAPE AND PROCESS FOR MAKING SAME
摘要 A multi-ply paper substrate is provided, which comprises at least two plies bonded to one another by an adhesive; a basis weight of 80-200 gsm; an internal bond of 10-180 milli-ft.-lb/sq. in. as measured by TAPPI method 541; an MD tensile of 20-300 lbf/inch width as measured by TAPPI method 494; and a CD tensile of 10-300 lbf/inch width as measured by TAPPI method 494. Methods of making and using the paper substrate, products made therefrom, and uses of the paper substrate are also provided.
申请公布号 WO2013013006(A1) 申请公布日期 2013.01.24
申请号 WO2012US47332 申请日期 2012.07.19
申请人 INTERNATIONAL PAPER COMPANY;ANDERSON, DENNIS, W.;SEALEY, JAMES, E. 发明人 ANDERSON, DENNIS, W.;SEALEY, JAMES, E.
分类号 D21H27/32 主分类号 D21H27/32
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