| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plate-like member supporting apparatus and a supporting method, and a plate-like member conveying apparatus capable of reliably supporting the plate-like member in a desired holding state while suppressing stress on the plate-like member. <P>SOLUTION: A pair of first holding means 71 varied in angle relative to a wafer W are moved closer to each other by a direct drive motor 52, and thereby the first holding means 71 are allowed to get close to the wafer W and a disadvantage of causing a conveyance failure can be eliminated even if a warp of the wafer W is large. Furthermore, when the wafer W is corrected to be flat, the direct drive motor 52 and a rotation motor 53 are interlocked to adjust a space across a pair of arms 6, and thereby the generation of local stress in the wafer W can be suppressed. <P>COPYRIGHT: (C)2013,JPO&INPIT |
