发明名称 |
APPARATUS AND METHODS FOR DRY ETCH WITH EDGE, SIDE AND BACK PROTECTION |
摘要 |
Embodiments of the present invention generally relate to a method and apparatus for plasma etching substrates and, more specifically, to a method and apparatus with protection for edges, sides and backs of the substrates being processed. Embodiments of the present invention provide an edge protection plate with an aperture smaller in size than a substrate being processed, wherein the edge protection plate may be positioned in close proximity to the substrate in a plasma chamber. The edge protection plate overlaps edges and/or sides on the substrate to provide protection to reflective coatings on the edge, sides, and back of the substrate. |
申请公布号 |
WO2012166265(A3) |
申请公布日期 |
2013.01.24 |
申请号 |
WO2012US34922 |
申请日期 |
2012.04.25 |
申请人 |
APPLIED MATERIALS, INC.;SINGH, SARAVJEET;SCOTT, GRAEME JAMIESON;SABHARWAL, AMITABH;KUMAR, AJAY |
发明人 |
SINGH, SARAVJEET;SCOTT, GRAEME JAMIESON;SABHARWAL, AMITABH;KUMAR, AJAY |
分类号 |
H01L21/3065 |
主分类号 |
H01L21/3065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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