| 摘要 |
A flexible circuit board according to an exemplary embodiment of the present invention includes a flexible base film including a liquid crystal panel bonding part at a side, which is bonded with a liquid crystal panel, a driving integrated circuit at a center of the flexible base film, a plurality of first conductive patterns on the flexible base film and extending from the driving integrated circuit to the liquid crystal panel bonding part, a solder resin layer exposing a first portion of the first conductive patterns, which is disposed on the liquid crystal panel bonding part, and covering a second portion of the first conductive patterns, which is a portion of the first conductive patterns other than the first portion, and a solder resin layer extending part protruding from an edge of the solder resin layer in a direction parallel to a direction in which the first conductive patterns extend. |
