Method For Grinding Side Portion of Hard, Brittle Material Substrate

摘要

An elastic abrasive with abrasive grains dispersed in or adhered to an elastic base material is ejected toward a side portion of a substrate together with compressed air. The elastic abrasive is ejected toward a predetermined processing area centered on a processing point in an ejection direction that intersects a widthwise line at the processing point and that forms a predetermined inclination angle selected from a range of 2° to 60° relative to a contact line. Moreover, an ejection nozzle and the workpiece are moved relatively to each other so that the processing area is moved at a fixed speed in a circumferential direction of the workpiece and so that the ejection direction is maintained at each processing point after moving. If multiple stacked substrates are to be processed, the processing area is moved at a fixed speed also in a widthwise direction of the substrates.