| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board manufacturing method which solves a problem of the past such that though wiring is successfully thinned, it is necessary to arrange a liquid body containing a liquid repellent material having liquid repellency on a part where an ink including a conductive material as a functional fluid is not necessary to be formed and dry or harden the liquid body because there is a process of forming a liquid repellent part, and it is necessary to perform, when including drying and hardening of the ink containing the conductive material, drying and hardening twice other than hardening of a resin material of a slope part. <P>SOLUTION: A wiring board manufacturing method in which a conductive pattern is formed on a base material by an inkjet method, comprises: a ground formation step of forming a ground layer of insulation containing unhardened hardening resin on the base material; a drawing step of forming a conductive pattern in the ground layer by injecting a pattern drawing ink containing conductive particles into the ground layer by an inkjet method; and a hardening step of hardening the ground layer. <P>COPYRIGHT: (C)2013,JPO&INPIT |
