Circuit carrier i.e. molded interconnect device, for integrated switching circuit, has contact element attached in substrate by mechanical vibrations and comprising projections and/or recesses to secure element against moving out of hole

摘要

The carrier (1) has an electrically conductive layer (22) i.e. strip conductor, formed on a substrate (20), where the electrically conductive layer is galvanically contactable. An electrically conductive contact element (3) i.e. socket, is arranged in a blind hole and comprises projections (24-27) arranged on a longitudinal portion of the contact element and/or radially inwardly facing recesses. The projections and/or the recesses secure the element against moving out of the hole in a form-fit manner. The element is attached in the substrate by mechanical vibrations i.e. ultrasound vibrations. The substrate is a molded interconnect device substrate. An independent claim is also included for a method for connecting a contact element with a circuit carrier.