| 摘要 |
<p>The present invention relates to a method and apparatus for connecting an electronic component using a high frequency electromagnetic field. The method according to one embodiment of the present invention is characterized in that it comprises a step of applying a high frequency to an adhesive provided on an electronic component to be connected so as to heat the adhesive and electrically and mechanically connect the electronic component, and the method for connecting the electronic component according to the present invention involves using high-frequency electromagnetic waves so as to heat a certain ingredient contained in an interposer and/or a polymer adhesive. By not using an external heat source, components can be connected at low temperatures, which is economical. Further, compared to an ultrasonic connection technique that vibrates an entire connecting structure, the method of the present invention, which heats a certain ingredient having chemical dipoles by means of a high-frequency electromagnetic field, exhibits no process limitations caused by external vibration. Moreover, unlike an ultrasonic technique using a fixed vibrator, frequency modulation performed by a user according to fixed conditions is easy so that components can be connected under various conditions according to the material types thereof.</p> |
