| 摘要 |
<P>PROBLEM TO BE SOLVED: To expose a die pad from a sealant in a die-pad-exposed-type semiconductor device. <P>SOLUTION: A semiconductor device includes: a die pad 1c; a bus bar 1d disposed around the die pad 1c; a plurality of inner leads 1a disposed around the bus bar 1d; a semiconductor chip 2 mounted on an upper surface 1ca of the die pad 1c; a plurality of wires 4 electrically connecting a plurality of electrode pads 2c of the semiconductor chip 2 and the plurality of inner leads 1a; a sealant 3 sealing the semiconductor chip 2 such that a lower surface 1cb of the die pad 1c is exposed; and a plurality of outer leads 1b exposed from the sealant 3. The bus bar 1d is disposed at a height between the inner leads 1a and a mounting surface 3b of the sealant 3 in the thickness direction of the sealant 3 such that the distance between the inner leads 1a and the bus bar 1d is the same as the distance between the bus bar 1d and the mounting surface 3b of the sealant 3 or is more than the distance between the bus bar 1d and the mounting surface 3b of the sealant 3. <P>COPYRIGHT: (C)2013,JPO&INPIT |
