| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead-free solder alloy having excellent heat resistance and spacer behavior as a jointing material which is used for an IC package that requires heat resistance at a high temperature, a power module which generates a large amount of heat for controlling driving of an onboard motor or other electric motors, or the like, and to provide a method of easily manufacturing the lead-free solder alloy. <P>SOLUTION: In a manufacturing process for a lead-free solder alloy whose basic composition is Sn-Cu, a solder alloy having a composition which contains a liquid phase of high temperature is heated to a liquidus-line temperature or higher, to be melted entirely. Then, in order that an intermetallic compounds whose main component is Cu<SB POS="POST">6</SB>Sn<SB POS="POST">5</SB>is generated and grown, the melted alloy is cooled while the temperature condition is controlled to thereby generate an intermetallic compound such as Cu<SB POS="POST">6</SB>Sn<SB POS="POST">5</SB>. After that, solder jointing is performed in a temperature condition in which the intermetallic compound, whose main component is Cu<SB POS="POST">6</SB>Sn<SB POS="POST">5</SB>that contains the solder alloy containing the intermetallic compound, does not disappear, thereby allowing solder jointing giving a solder junction part that contains the intermetallic compound. <P>COPYRIGHT: (C)2013,JPO&INPIT |
