| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit board and manufacturing method therefor, capable of preventing peeling-off of a metal plate resulting from a gap between an insulative core substrate and a metal plate. <P>SOLUTION: A circuit board 20, comprising patterned copper plates 50, 70 bonded to surfaces of insulative core substrates 40, 60 and a packaged electronic component 80, includes through holes 90, 91 for venting, to atmosphere open side, gas that is between the insulative core substrates 40, 60 and the copper plates 50, 70 and that expands when the electric component 80 is packaged, in a laminate S1 comprised of the insulative core substrates 40, 60 and the copper plates 50, 70. <P>COPYRIGHT: (C)2013,JPO&INPIT |
