| 摘要 |
<P>PROBLEM TO BE SOLVED: To allow effective discrimination of whether a wafer has been subject to ultraviolet irradiation after dicing. <P>SOLUTION: A semiconductor manufacturing method comprises: a dicing process S10 of cutting a wafer fixed to a predetermined position of a dicing sheet including a substrate, a pressure-sensitive adhesive layer formed by a pressure-sensitive adhesive material that has an adhesive strength to be reduced by ultraviolet irradiation and a discolored layer formed by an ultraviolet photosensitive material to be discolored by ultraviolet irradiation; an ultraviolet irradiation process S20 of irradiating the substrate with ultraviolet after the dicing process S10; a discrimination process S30 of discriminating based on a color of the discolored layer, whether the wafer has been subject to the ultraviolet irradiation process S20; and a pickup process S40 of picking up chips after the discrimination process S30, from the wafer having been subject to the ultraviolet irradiation process S20. <P>COPYRIGHT: (C)2013,JPO&INPIT |
