METHOD OF FLIP-CHIP HYBRIDIZATION FOR FORMING AIRTIGHT CAVITIES, AND SYSTEM OBTAINED BY THE METHOD

摘要

PROBLEM TO BE SOLVED: To provide a method of flip-chip hybridization for forming airtight cavities and a system obtained by the method.

SOLUTION: The present invention provides a method for manufacturing a microelectronic assembly comprising at least one first and one second microelectronic components, one of which is placed on top of the other and between which at least one airtight cavity embedded in a filling material is formed. The method comprises the steps of: defining the cavity using a lateral wall; forming an obstacle capable of forming a bypass duct with respect to a filling material in cooperation with the lateral wall; performing a flip-chip hybridization of the first and second components; and injecting the filling material in liquid form between the two hybridized components.

COPYRIGHT: (C)2013,JPO&INPIT