发明名称 WIRED CIRCUIT BOARD
摘要 A wired circuit board includes an insulating layer, and a conductive layer formed on the insulating layer. The insulating layer includes a first insulating layer, and a second insulating layer formed on the first insulating layer. The conductive layer includes a first conductive pattern, and a second conductive pattern. The first conductive pattern includes a first connecting portion formed on the first insulating layer and under the second insulating layer, and at least one pair of first terminals configured continuously to the first connecting portion so as to electrically connect to an external electronic element and spaced apart from each other to allow the electronic element to extend therebetween. The second conductive pattern includes a second connecting portion formed on the second insulating layer, and a second terminal configured continuously to the second connecting portion so as to electrically connect to a magnetic head provided on an external slider.
申请公布号 US2013020112(A1) 申请公布日期 2013.01.24
申请号 US201213554799 申请日期 2012.07.20
申请人 NITTO DENKO CORPORATION;OHSAWA TETSUYA 发明人 OHSAWA TETSUYA
分类号 H05K1/02;H05K1/05 主分类号 H05K1/02
代理机构 代理人
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