发明名称 ANISOTROPIC CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To provide an anisotropic conductive material which can enhance the conduction reliability by hardening the material quickly when it is used for electrical interconnection of electrodes, and can enhance the connection reliability of a connection structure thus obtained under high temperature and high humidity. <P>SOLUTION: The anisotropic conductive material contains a thermosetting component and conductive particles 5. When the elastic modulus of a hardened material of the anisotropic conductive material before leaving at a temperature of 85&deg;C and a humidity of 85% for 48 hours represents E1, and after leaving at a temperature of 85&deg;C and a humidity of 85% for 48 hours represents E2, the E2 is 500 MPa or higher, and the Log(E2/E1) indicating the change of elastic modulus of E1 and E2 is -0.65 or more. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013016473(A) 申请公布日期 2013.01.24
申请号 JP20120128816 申请日期 2012.06.06
申请人 SEKISUI CHEM CO LTD 发明人 ISHIZAWA HIDEAKI;KUBOTA TAKASHI;YUKI AKIRA;SHIMAOKA JUNICHI
分类号 H01B1/22;C08F2/44;C08F292/00;C08K3/08;C08L33/04;H01B1/00;H01R11/01;H01R12/62;H05K1/14;H05K3/32 主分类号 H01B1/22
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