PRE-CUT WAFER APPLIED UNDERFILL FILM ON DICING TAPE
摘要
A method for preparing a semiconductor with preapplied underfill comprises (a) providing a thinned silicon semiconductor wafer having a plurality of metallic bumps on its active face and, optionally, through-silica-vias vertically through the silicon semiconductor wafer; (b) providing an underfill material on a dicing support tape, in which the underfill material is precut to the shape of the semiconductor wafer; (c) aligning the underfill material on the dicing support tape with the semiconductor wafer and laminating the underfill material to the semiconductor wafer.
申请公布号
WO2012106223(A3)
申请公布日期
2013.01.24
申请号
WO2012US23068
申请日期
2012.01.30
申请人
HENKEL CORPORATION;HOANG, GINA;KIM, YOUNSANG;GUINO, ROSE