| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package, and a method for manufacturing the semiconductor package, and a method capable of peeling a semiconductor element from the semiconductor package for easily peeling the semiconductor element from the semiconductor package, reducing possibility that the semiconductor is damaged, and realizing the reuse of the semiconductor package. SOLUTION: This system is provided with a semiconductor package 24 having plural legs 15b of a lead frame, semiconductor element 12 arranged at a central planar part 15a of the semiconductor package 24 and provided with plural bonding wires 16 conductively connected with plural inside terminals 15c of the lead frame, and plate 26 for peeling the semiconductor element arranged to be interposed between the central plane part 15a and the semiconductor element 12 and adhered with adhesive 25 between the central planar part 15a and the semiconductor element 12.
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