发明名称 Method and device for producing a hardened metallic component with at least two areas of different ductility
摘要 <p>Producing a hardened metallic component with at least two regions of different ductility of a board (2), comprises: transporting the board quasi continuously and substantially without interruption to a press (6) through a heating furnace (3), then through a cooling- and heating zone (4); heating the board in the heating furnace homogeneously to a temperature above the austenitizing temperature; transporting a first region of the board through a furnace (8); and inserting the board into the press after the transport to the end portion of the cooling- and heating zone. Producing a hardened metallic component with at least two regions of different ductility of a board (2), comprises: transporting the board quasi continuously and substantially without interruption to a press (6) through a heating furnace (3), then through a cooling- and heating zone (4); heating the board in the heating furnace homogeneously to a temperature above the austenitizing temperature; transporting a first region of the board through a furnace (8), which is adjoining the heating furnace, during the quasi-continuous transport through the cooling- and heating zone, where the first region is held at a temperature above the austenitizing temperature without intermediate temperature reduction, and a second region of the board is transported outside of the furnace and cooled; and inserting the board into the press after the transport to the end portion of the cooling- and heating zone, when the structural transformations in the second region of the board are not completely terminated. An independent claim is also included for a device for producing a hardened metallic component, comprising a transport device for the quasi-continuous transport of at least one board, a heating furnace for the homogeneous heating of at least one board to a temperature above the austenitizing temperature and a cooling and heating zone, where transport device transporting at least one board leads through the heating furnace and the cooling- and heating zone. The cooling- and heating zone has furnace located directly on the heating furnace, which comprises a through opening extending sideways and in the direction of transport. The transport device can be arranged in the furnace over its entire width or in sections in its width direction. The remaining width section of the transport device extends through the passage opening, and runs outside the furnace, in an arrangement with a width section of the transport device, which is arranged in the furnace.</p>
申请公布号 EP2548975(A1) 申请公布日期 2013.01.23
申请号 EP20110174619 申请日期 2011.07.20
申请人 LOI THERMPROCESS GMBH 发明人 GOCKEL, ALFONS;JAKOBSHAGEN, PETER;OEZKAN, BORA
分类号 C21D1/20;C21D1/673;C21D9/00;F27B9/24 主分类号 C21D1/20
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