| 摘要 |
PURPOSE: An apparatus for polishing the edge of a wafer is provided to decrease the use amount of slurry by supplying slurry intensively a part of a grinding pad touching the edge of the wafer. CONSTITUTION: A chuck(50) loads a wafer. A drum(30) is arranged in the upper part of the chuck. A grinding pad(210) polishes the edge of the wafer loaded in the chuck. A slurry supplying pipe(220) supplies slurry through the drum. An injection nozzle(230) sprays the slurry supplied from the slurry supplying pipe to the grinding pad.
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