| 摘要 |
PURPOSE: A light emitting device is provided to efficiently dissipate the heat generated from a light emitting diode by using a thermal dissipation pattern. CONSTITUTION: Multiple lead frames(21,23) are arranged in the bottom part of a cavity. A light emitting chip(15) is mounted on at least one among lead frames. A molding material(17) is formed in the cavity. The lead frame includes a thermal dissipation pattern(32). The thermal dissipation pattern has a plurality of convex parts.
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