发明名称 METHOD FOR CONNECTING CONDUCTIVE CIRCUIT ON PAPER
摘要 PROBLEM TO BE SOLVED: To laminate a conductive circuit using a paper as substrate. SOLUTION: After staples 5 and a circuit 3 are connected with the conductive staples 5 pierced through in a manner touching the circuit 3 formed on both sides of a sheet of paper 1 or the circuit 3 formed on non-joining surface of a laminated paper 1, exposed parts of the staples are covered by conductive bodies 4 to electrically connect the circuits 3 with each other via the staples 5.
申请公布号 JP2000286548(A) 申请公布日期 2000.10.13
申请号 JP19990093980 申请日期 1999.03.31
申请人 TOPPAN FORMS CO LTD 发明人 ENDO YASUHIRO;KAGAMI YASUO;MARUYAMA TORU
分类号 H05K3/40;(IPC1-7):H05K3/40 主分类号 H05K3/40
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