| 摘要 |
PROBLEM TO BE SOLVED: To manufacturing a printed wiring board with an improve circuit shape by the semi-additive method by setting etching liquid for eliminating a first metal covering by etching to chemical reaction speed-control type etching liquid. SOLUTION: A plating catalyst 2 is given to the surface of an insulation substrate 1. Then, electroless plating is made with the plating catalyst 2 as a nucleus, and a thin, first metal covering 3 is formed on the entire surface of the insulation substrate 1. Then, a resist covering 4 is formed at a part excluding a part where a circuit is scheduled to be formed out of the surfaces of the first metal covering 3, then the first metal covering 3 is energized for performing electrical plating, and then a second metal covering 5 is formed on the surface of a part where the first metal covering 3 is exposed. Then, after the resist covering 4 is eliminated, the first metal covering 3 is eliminated by etching. In that case, by using chemical reaction speed-control type etching liquid, the surface of the second metal covering 5 can be etched nearly uniformly even if etching is made to the extent that the first metal covering 3 is eliminated.
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