摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a thermoelectric module, wherein a skeleton type thermoelectric module where only an end surface of a thermoelectric element is selectively plated is manufactured at high mass- productivity. SOLUTION: Thermoelectric semiconductor elements 12n and 12p are penetrated and fixed in a plurality of support plates 11, which erected side by side, comprise a plurality of through-holes, and then a coating layer C of plating- liquid resistance is coated on the exposed surface. First and second element members are cut on both sides of the support plate 11, and the first and second element members which were cut are plated. The coating layer C is removed, together with a plating N laminated on the coating layer C. An electrode member is bridged and fixed, between end surfaces of the plated n-type thermoelectric semiconductor element 12n and p-type thermoelectric semiconductor element 12p through soldering. The n-type thermoelectric semiconductor element 12n and the p-type thermoelectric semiconductor element 12p are connected alternately and electrically in series.
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