发明名称 |
SEMICONDUCTOR DEVICE HAVING SELECTIVE EPITAXIAL GROWTH LAYER AND ISOLATION METHOD THEREOF |
摘要 |
PURPOSE: A method for isolating a semiconductor device having a selective epitaxial growth layer is provided to prevent an insulating layer from being peeled off or to prevent a void from being generated between the insulating layer and a silicon substrate, by making a sidewall of an opening have a positive incline in etching the insulating layer to reduce the stress applied by a selectively epitaxial growth to the insulating layer. CONSTITUTION: An insulating layer(12) for isolation is formed on a silicon substrate(10). The insulating layer for isolation is selectively etched to make a sidewall have a predetermined positive incline angle, and an opening is formed to expose the surface of the silicon substrate. The silicon exposed to the inside of the opening is used as a seed and selectively epitaxial-grown to be lower than the insulating layer. A sacrificial oxide layer is formed on the selectively epitaxial-grown silicon. The sacrificial oxide layer is eliminated. |
申请公布号 |
KR20010010041(A) |
申请公布日期 |
2001.02.05 |
申请号 |
KR19990028720 |
申请日期 |
1999.07.15 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
MUN, HONG BAE |
分类号 |
H01L21/76;H01L21/20;H01L21/762;(IPC1-7):H01L21/76 |
主分类号 |
H01L21/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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