发明名称 Copper-based sliding material
摘要 <p>A copper-based sliding material consisting of: 5.0 to 25.0 mass % of Zn; 4.2 to 10.0 mass % of Bi; 2.0 to 7.0 mass % of Mn; 1.0 to 3.0 mass % of Si; 0.1 to 2.0 mass % of Sn; and the balance being Cu and unavoidable impurities is provided. The copper-based sliding material includes a single α-phase matrix (1, 2), a Mn-Si compound (3) and a Bi-particle phase (4). The Mn-Si compound (3) and the Bi-particle phase (4) are dispersed in the single α-phase matrix (1, 2). The mass ratio of Sn to Bi is 0.024 to 0.200, preferably 0.050 to 0.140. </p>
申请公布号 EP2135964(A3) 申请公布日期 2013.01.23
申请号 EP20090008100 申请日期 2009.06.19
申请人 DAIDO METAL COMPANY LTD. 发明人 OCHI, SHINJI;TODA, KAZUAKI;YAGO, WATARU;YASUKAWA, JUN;FUJIYAMA, KOUJI
分类号 C22C9/04 主分类号 C22C9/04
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