发明名称 |
Copper-based sliding material |
摘要 |
<p>A copper-based sliding material consisting of: 5.0 to 25.0 mass % of Zn; 4.2 to 10.0 mass % of Bi; 2.0 to 7.0 mass % of Mn; 1.0 to 3.0 mass % of Si; 0.1 to 2.0 mass % of Sn; and the balance being Cu and unavoidable impurities is provided. The copper-based sliding material includes a single α-phase matrix (1, 2), a Mn-Si compound (3) and a Bi-particle phase (4). The Mn-Si compound (3) and the Bi-particle phase (4) are dispersed in the single α-phase matrix (1, 2). The mass ratio of Sn to Bi is 0.024 to 0.200, preferably 0.050 to 0.140.
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申请公布号 |
EP2135964(A3) |
申请公布日期 |
2013.01.23 |
申请号 |
EP20090008100 |
申请日期 |
2009.06.19 |
申请人 |
DAIDO METAL COMPANY LTD. |
发明人 |
OCHI, SHINJI;TODA, KAZUAKI;YAGO, WATARU;YASUKAWA, JUN;FUJIYAMA, KOUJI |
分类号 |
C22C9/04 |
主分类号 |
C22C9/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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