| 摘要 |
<p>PURPOSE: A method for processing an optical device wafer is provided to prevent damage to an optical device layer by absorbing the energy of pulse laser beams in a buffer layer. CONSTITUTION: A laser processing device includes a chuck table(51) and a laser beam radiating unit(52). The chuck table maintains an optical device wafer(2) on a maintaining surface. The laser beam radiating unit includes a cylindrical casing which is horizontally arranged. A pulse laser beam oscillating unit is installed in the casing. A collector(522) is mounted on the end of the casing to collect pulse laser beams.</p> |
