HEAT SINK, MEMORY MODULE HAVING THE SAME AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a heat sink, a memory module having a structure wherein the heat sink can be easily bound with the memory module and a method for manufacturing the memory module. SOLUTION: The heat sink 10 is attached to a memory module substrate 30 on which a plurality of semiconductor chips 32 are mounted and radiates heat generated from the semiconductor chips 32. The heat sink 10 contains binding means 20 for binding the heat sink 10 to the memory module substrate 30 and holes into which the binding means 20 penetrate. The binding means 20 contain first and second bodies which are collectively formed integrally and flange parts collectively formed integrally with the second bodies. Orifices are formed by penetrating at least the second bodies. The flanges are fixed on one surface of the memory module substrate 30, and the first bodies are smaller than the second bodies.