| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To make it hard for the heat generated in a control chip to be transmitted to a sensor chip, and also to reduce a stress imposed on the sensor chip due to a temperature change, in a sensor device constituted by fitting the sensor chip and the control chip to a case. <P>SOLUTION: The sensor chip 20 and the control chip 30 are provided in the case 10 and these are connected by a connecting member 40 and moreover sealed with sealing resin 50. The connecting member 40 is connected to one side of a part in the sensor chip 20, which is located to the control chip 30, while the other side of the part in the sensor chip 20, located to the control chip 30, is adhered directly to the case 10 with an adhesive 70 to be fixed on the case 10. The end portion on the sensor chip 20 side in the sealing resin 50 extending to the sensor chip 20 side from the control chip 30 side is made to be located at the same position as the end portion in the adhesive 70, on the opposite side to the end portion of the control chip 30 side, and the portion in the case 10 which is positioned just under the adhesive 70 is made to be formed of the same resin material as the sealing resin 50. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
