发明名称 Mold device for injection molding of synthetic resin
摘要 In a mold device for injection molding of synthetic resin having a cavity surface alternately heated and cooled and a bottoming structure for producing a product having a bored portion like a window, a bottoming portion for the production of a product having a bored portion is provided on a parting surface of the mold and a vacant space is provided in the bottoming portion. Thus, the contact area of the bottoming portion is reduced and a contact pressure of the bottoming portion and thermal strain due to a temperature difference between the cavity side mold and core side mold are reduced, so that it is possible to prevent occurrence of crack in a portion located immediately outside the window of the product. In a mold device for injection molding of synthetic resin having a cavity surface alternately heated and cooled and a slide structure, a mold base and a slide cavity block arranged in the slide core provided in the mold base are separately thermally controlled so that it is possible to prevent galling between the mold base and the slide core of the slide structure.
申请公布号 US2002094354(A1) 申请公布日期 2002.07.18
申请号 US20010033217 申请日期 2001.12.28
申请人 KIMURA NAOYOSHI;TAKAHASHI FUMIO;YAMAKI MASAHIKO;IMAGAWA AKIHIKO;MIKAWA MITSUHARU 发明人 KIMURA NAOYOSHI;TAKAHASHI FUMIO;YAMAKI MASAHIKO;IMAGAWA AKIHIKO;MIKAWA MITSUHARU
分类号 B29C45/33;B29C45/34;B29C45/73;(IPC1-7):B29C45/44 主分类号 B29C45/33
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