| 发明名称 |
APPARATUS FOR HEAT-TREATING SUBSTRATE |
| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for cooling a heat-treated substrate to a low temperature in a short time in a state of being held in a heat treat furnace of an atmosphere with controlled concentration. SOLUTION: A cooling plate 34 is provided for cooling the heat-treated wafer W in the heat treat furnace 22 maintained in a prescribed gas concentration atmosphere.
|
| 申请公布号 |
JP2002203803(A) |
申请公布日期 |
2002.07.19 |
| 申请号 |
JP20000399942 |
申请日期 |
2000.12.28 |
| 申请人 |
DAINIPPON SCREEN MFG CO LTD |
发明人 |
HASHIZUME AKIO |
| 分类号 |
B25J15/00;B25J15/08;B65G49/07;H01L21/205;H01L21/26;H01L21/28;(IPC1-7):H01L21/26 |
主分类号 |
B25J15/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
