| 摘要 |
PROBLEM TO BE SOLVED: To reduce the mechanical stresses concentrated to lead wires when such a mechanical stress as the vibration, rotational force, etc., is applied to chip type electronic parts. SOLUTION: In the chip type electronic parts composed of a main body having a plurality of lead wires led out from the same end face and an insulating plate which is brought into contact with the led-out sides of the lead wires, the lead wires are bent along the lower surface of the insulating plate after the wires are passed through the through holes made through the insulating plate for the lead wires. In addition, an elastic material is interposed between the internal surfaces of the through holes and the lead wires passed through the holes. Consequently, when such a mechanical stress as the vibration, rotational force, etc., is applied to the chip type electronic parts, the elastic material reduces the mechanical stresses applied to the bent sections of the lead wires which are weakened in mechanical strength by absorbing the mechanical stresses applied to the lead wires.
|
