<p>The present invention relates to lead frame for a semiconductor device and a semiconductor device comprising such a lead frame. The lead frame comprises a die mounting portion and a plurality of leads extending from the die mounting portion; wherein the leads further comprise a plurality of protrusions, said protrusions being arranged to grip a mould shutting strip.</p>
申请公布号
EP2549531(A1)
申请公布日期
2013.01.23
申请号
EP20110174865
申请日期
2011.07.21
申请人
NXP B.V.
发明人
YANDOC, RICARDO, L;HEYES, DAVID;LICTAO, CRISPULO, E.;CACANINDIN, WILSON;FENOL, FLORANTE, B.